AUGEAS TECHNOLOGIESWe build the hard parts.
Augeas Technologies designs and manufactures high-voltage plasma power systems, and the embedded control and software behind them, in Hyderabad.
Capabilities we use every day.
Nothing here was built for a brochure. Each one is doing a job in a product we make, the product is the proof.
High-voltage & RF power
Plasma runs on high voltage, delivered precisely and monitored constantly. We design the power electronics, switching, and protection ourselves. Proven in: Plasma Systems · Plasma Knife
Embedded firmware
Control loops, safety interlocks, and fault handling on ESP32, C2000, and STM32. Our firmware runs machines with kilovolts inside, it has to be right. Proven in: every product we build
Thermal & IR sensing
Reading real heat in messy real-world conditions, and deciding when it matters. Our stove-fire product watches every burner this way. Proven in: Stovyn (pre-launch)
NFC, BLE & secure identity
Tags, readers, provisioning, and the cloud behind them. A tap identifies an asset and reaches its owner without exposing personal details. Proven in: NFCFind, live on iOS & Android
Cloud backends & fleets
Accounts, device fleets, alerts, APIs, and event history, the plumbing that keeps hardware useful in the field. Proven in: NFCFind · Stovyn
Mechanical & manufacturing
Enclosure design, then the build itself: PCB procurement and assembly to IPC Class II workmanship, prototype to low-rate production. Proven in: Augeas PCBFlow
Straight answers for evaluators.
On registrations. We are an MSME and a DPIIT-recognised startup, registered in Hyderabad, India, and we hold a Dun & Bradstreet D-U-N-S® number. We do not yet hold defence-specific credentials, no ITAR registration, no CMMC assessment, no security clearances, no ISO or AS9100 certificate, and we won’t print a badge until we hold the thing it stands for. If your programme requires a specific registration, we’ll say so in our first reply and undertake it as part of the engagement. Until then, please don’t send classified or export-controlled material, we are not yet set up to receive it.
How we engage
Build-to-print, your drawings: PCB assembly at our qualified partner board houses, box build, wiring and test in our Hyderabad facility, all to IPC Class II workmanship.
Co-development, from requirement to working prototype: electronics, firmware, mechanicals, and the cloud behind them.
Feasibility & R&D, short, fixed-scope studies in high-voltage plasma, thermal sensing, and secure identity.
What to expect
A reply from an engineer, not a sales layer. Honest no-bids when a requirement is outside our reach. Small-firm speed on RFIs, samples, and evaluation units, and one team accountable for the whole chain, from sensor to cloud.
Working on a programme?
Send an RFI or RFQ, an engineer replies, not a sales layer.