AUGEAS TECHNOLOGIESWe build the hard parts.
High-voltage plasma. Firmware that runs beside heat, flame, and kilovolts. NFC identity that never exposes its owner. Electronics assembled to IPC Class II workmanship. We built these for our own products — and they apply to government and defence programmes in India and the United States.
Capabilities we use every day.
Nothing here was built for a brochure. Each one is doing a job in a product we make — the product is the proof.
High-voltage & RF power
Plasma runs on high voltage, delivered precisely and monitored constantly. We design the power electronics, switching, and protection ourselves. Proven in: Plasma Systems · Plasma Knife
Embedded firmware
Control loops, safety interlocks, and fault handling on ESP32, C2000, and STM32. Our firmware runs machines with kilovolts inside — it has to be right. Proven in: every product we ship
Thermal & IR sensing
Reading real heat in messy real-world conditions, and deciding when it matters. Our stove-fire product watches every burner this way. Proven in: Stovyn (pre-launch)
NFC, BLE & secure identity
Tags, readers, provisioning, and the cloud behind them. A tap identifies an asset and reaches its owner without exposing personal details. Proven in: NFCFind — live on iOS & Android
Cloud backends & fleets
Accounts, device fleets, alerts, APIs, and event history — the plumbing that keeps hardware useful in the field. Proven in: NFCFind · Stovyn
Mechanical & manufacturing
Enclosure design, then the build itself: PCB procurement and assembly to IPC Class II workmanship, prototype to low-rate production. Proven in: Augeas PCBFlow
Straight answers for evaluators.
On registrations. We are registered in Hyderabad, India (GSTIN) and hold a Dun & Bradstreet D-U-N-S® number. We do not yet hold defence-specific credentials — no ITAR registration, no CMMC assessment, no security clearances, no ISO or AS9100 certificate — and we won’t print a badge until we hold the thing it stands for. If your programme requires a specific registration, we’ll say so in our first reply and undertake it as part of the engagement. Until then, please don’t send classified or export-controlled material — we are not yet set up to receive it.
How we engage
Build-to-print — your drawings, our line: PCB assembly and box-build to IPC Class II workmanship.
Co-development — from requirement to working prototype: electronics, firmware, mechanicals, and the cloud behind them.
Feasibility & R&D — short, fixed-scope studies in high-voltage plasma, thermal sensing, and secure identity.
What to expect
A reply from an engineer, not a sales layer. Honest no-bids when a requirement is outside our reach. Small-firm speed on RFIs, samples, and evaluation units — and one team accountable for the whole chain, from sensor to cloud.
Working on a programme?
Send an RFI or RFQ — an engineer replies from both our India and US teams.